Indium ke tšepe e tšoeu, e bonolo haholo, e bonolo haholo ebile e le ductile. Cold weldability, le tse ling tse khohlano tšepe e ka bakhomaretse, mokelikeli indium motsamao o babatsehang. Indium ea tšepe ha e na oxidized ke moea ka mocheso o tloaelehileng, indium e qala ho oxidized hoo e ka bang 100 ℃, (Ka mocheso o ka holimo ho 800 ℃), indium e chesa ho etsa indium oxide, e nang le lelakabe le leputsoa le leputsoa. Ho hlakile hore Indium ha e kotsi 'meleng oa motho, empa metsoako e qhibilihang e na le chefo.
Ntho ea Teko | Standard | Liphetho |
In | ≥99.99% | 99.999% |
Al | ≤0.0003% | 0.0001% |
Ag | ≤0.0001% | 0.00002% |
As | ≤0.0001% | 0.00001% |
B | ≤0.00005% | 0.00001% |
Ba | ≤0.0001% | 0.00001% |
Bi | ≤0.0001% | 0.00001% |
Ca | ≤0.0001% | 0.00001% |
Cd | ≤0.0001% | 0.00001% |
Co | ≤0.0001% | 0.00001% |
Cr | ≤0.0001% | 0.00002% |
Cu | ≤0.0001% | 0.00005% |
Fe | ≤0.0002% | 0.00006% |
Mg | ≤0.0001% | 0.00003% |
Mn | ≤0.0001% | 0.00002% |
Mo | ≤0.0001% | 0.00001% |
Ni | ≤0.00005% | 0.00001% |
Pb | ≤0.0001% | 0.00001% |
Sb | ≤0.00005% | 0.000006% |
Si | ≤0.0002% | 0.00003% |
Qetello | Latela maemo a holimo |
a.Indium nanoparticles e ka sebelisoa ka slurry ea elektronike bakeng sa semiconductor, alloy e nang le bohloeki bo phahameng le lisele tsa letsatsi tsa silicon. E ka fokotsa mocheso oa sintering.
b.Ka nanopowder e ka eketsoa ka alloy welding e le ho theola ntlha e qhibilihang ea alloy.
c.E ka boela ea eketsa khanyetso ea alloy.
d.Haeba e sebelisoa ka oli ea lubricant, ho hanyetsa ha oli ea lubricant ho tla eketseha.
e. Ka nanoparticles e ka boela ea sebelisoa e le ntlafatso ea mollo bakeng sa mafura a rocket.
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